Improvement of thermal properties and flame retardancy of epoxy-amine thermosets by introducing bisphenol containing azomethine moiety
X. H. Zhang, L. H. Huang, S. Chen, G. R. Qi
Vol. 1., No.5., Pages 326-332, 2007
DOI: 10.3144/expresspolymlett.2007.46
DOI: 10.3144/expresspolymlett.2007.46
Corresponding author: X. H. Zhang 
GRAPHICAL ABSTRACT
ABSTRACT
A novel bisphenol 1, 4'-bis{4-[(4-hydroxy) phenyliminomethylidene] phenoxy} benzene (BHPB), which contains azomethine moiety and flexible aromatic ether linkage, was synthesized and introduced into the curing system composed of diglycidyl ether of bisphenol A (DGEBA) and diamine. The curing behavior of DGEBA/diamine changed dramatically due to the introduction of BHPB. The resultant epoxy thermosets containing BHPB had high Tgs (127-160 °C), high Td, 5% (>=330°C) and high integral procedure decomposition temperature (IPDT) values (662-1230°C) and good flame retardancy for their high Limited Oxygen Index (LOI) values (above 29.5).
