Fracture behaviour of a self-healing microcapsule-loaded epoxy system
J. Lee, D. Bhattacharyya, M. Q. Zhang, Y. C. Yuan
Vol. 5., No.3., Pages 246-253, 2011
DOI: 10.3144/expresspolymlett.2011.24
DOI: 10.3144/expresspolymlett.2011.24
Corresponding author: J. Lee 
GRAPHICAL ABSTRACT
ABSTRACT
The effect of temperature on the fracture behaviour of a microcapsule-loaded epoxy matrix was investigated. Microencapsulated epoxy and mercaptan-derivative healing agents were incorporated into an epoxy matrix to produce a polymer composite capable of self-healing. Maximum fracture loads were measured using the double-torsion method. Thermal aging at 55 and 110°C for 17 hours [hrs] was applied to heal the pre-cracked samples. The addition of microcapsules appeared to increase significantly the load carrying capacity of the epoxy after healing. Once healed, the composites achieved as much as 93–171% of its virgin maximum fracture load at 18, 55 and 110°C. The fracture behavior of the microcapsule- loaded epoxy matrix was influenced by the healing temperature. The high self-healing efficiency may be attributed to the result of the subsurface micro-crack pinning or deviation, and to a stronger microencapsulated epoxy and mercaptanderivative binder than that of the bulk epoxy. The results show that the healing temperature has a significant effect on recovery of load transferring capability after fracture.
