Influence of nano-AlN particles on thermal conductivity, thermal stability and cure behavior of cycloaliphatic epoxy/trimethacrylate system
J. H. Yu, J. K. Duan, W. Y. Peng, L. C. Wang, P. Peng, P. K. Jiang
Vol. 5., No.2., Pages 132-141, 2011
DOI: 10.3144/expresspolymlett.2011.14
DOI: 10.3144/expresspolymlett.2011.14
Corresponding author: J. H. Yu 
GRAPHICAL ABSTRACT
ABSTRACT
We have prepared a series of nano-sized aluminium nitride (nano-AlN)/cycloaliphatic epoxy/trimethacrylate (TMPTMA) systems and investigated their morphology, thermal conductivity, thermal stability and curing behavior. Experimental results show that the thermal conductivity of composites increases with the nano-AlN filler content, the maximum value is up to 0.47 W/(m.K). Incorporation of a small amount of the nano-AlN filler into the epoxy/TMPTMA system improves the thermal stability. For instance, the thermal degradation temperature at 5% weight loss of nano-AlN/epoxy/TMPTMA system with only 1 wt% nano-AlN was improved by ~8ºC over the neat epoxy/TMPTMA system. The effect of nano-AlN particles on the cure behavior of epoxy/TMPTMA systems was studied by dynamic differential scanning calorimetry. The results showed that the addition of silane treated nano-AlN particles does not change the curing reaction mechanism and silane treated nano-AlN particles could bring positive effect on the processing of composite since it needs shorter pre-cure time and lower pre-temperature, meanwhile the increase of glass transition temperature of the nanocomposite improves the heat resistance.
